Retrofitting a Colocation Facility For Leading Semiconductor Design & AI Infrastructure Company

• Timeline: March ‒ July, 2026
• Project Duration: 4 Months
• Location: Oakland, US
• Scale: 1 MW/ 32 racks/ 3 CDUs

About The Project

1. Customer need

A global semiconductor design and AI infrastructure company needed to deploy high-density compute racks within an existing air-cooled colocation facility—without disrupting ongoing operations.

2. Solution delivered

• Engineered and deployed the complete secondary cooling loop, CDUs, piping, manifolds, and rack-level connections.
• Remediated electrical distribution, circuiting, grounding, and underfloor routing for high-density compute.
• Integrated cooling equipment, energy valves, and leak detection with the facility’s BMS.
• Managed engineering, permitting, installation, testing, and commissioning through production-ready handoff.

3. Results

• Delivered in four months.
• Completed the facility’s first liquid-cooling deployment.
• Created a single point of accountability across all technical disciplines.
• Established a scalable foundation for future compute capacity.